- Type: Bulk Hot Melt
- Brand: Power Adhesives
- Bonds: Cardboard, Foam
- Application: Packaging
More About Tecbond 4602F
The Tecbond 4602F glue is an extremely high-performance, heat-stable (in both high and low temperatures) bulk hot melt for the packaging industry. The Tecbond 4602F adhesive offers very low odor and clean machining with low char for fewer filter and nozzle blockages.
Tecbond 4602F is also FDA-approved for food and microwave packaging.
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Tecbond 4602F Specs
- Color: White
- Suggested Application Temp: 320F
- Brookfield Viscosity: 1,700 cps
- Softening Point: 225F
- Form: Pastilles
Power Adhesives Tecbond 4602F Data Sheets
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