Power Adhesives Tecbond 5931F Bulk Freezer-Grade Hot Melt
Product Highlights
- Type: Bulk Hot Melt
- Brand: Power Adhesives
- Bonds: Cardboard, Foam
- Application: Product Assembly
Tecbond 5931F Freezer-Grade Glue
The Tecbond 5931F glue is a freezer-grade packaging hot melt offering excellent adhesion to a wide range of materials meant to be in deep freezer environments like boards and papers. Tecbond 5931F remains flexible all the way down to -40 Degrees F.
The 5931F adhesive is a high-performance hot melt giving good, clean machining with low char and clogging. It can also be used where a fast melt down tank is required.
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Power Adhesives Tecbond 5931F Specs
- Color: Pale White
- Suggested Application Temp: 320F
- Brookfield Viscosity: 1,100 cps
- Softening Point: 190F
- Form: Prills
Tecbond 5931F Data Sheets
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