Power TEC Bond 2378 Product Assembly Bulk Hot Melt
Product Highlights
- Type: Bulk Hot Melt
- Brand: Power Adhesives
- Adhesive Temperature: High Temperature
- Set Speed: Medium
- Bonds: Cardboard, General, Plastic, Wood
- Application: Product Assembly
About the Power Adhesives TEC Bond 2378 Bulk Hot Melt Adhesive
TEC Bond 2378 is a high performance bulk hot melt mainly used for product assembly because of its versatility and high bond strength. The 2378 bonds paper, wood, light metals and plastic while offering both high and low temperature resistance.
Power 2378 has a long open time, allowing fine tuning after the adhesive has been applied.
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Power TEC Bond 2378 Specs
- Color: Dark Amber
- Suggested Application Temp: 356F
- Brookfield Viscosity: 3,900 cps
- Softening Point: 288F
- Form: Slats
Power TEC Bond 2378 MSDS & TDS Sheets
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