Power Adhesives Tecbond 110B High-Speed Packaging Hot Melt

Tecbond 110B Biodegradable Hot Melt Adhesive

Formulated with sustainability in mind, the Tecbond 110B glue offers an eco-conscious alternative to traditional packaging adhesives.

Packaging Applications

The Tecbond 110B adhesive is a biodegradable bulk hot melt designed for high-speed case sealing and carton closing. This low-viscosity adhesive runs efficiently through narrow nozzles at lower temperatures, reducing energy consumption while maintaining strong, reliable bonds on cardboard and paper substrates. Its 10-second open time makes it ideal for fast-paced, end-of-line (EOL) packaging operations. As a result, manufacturers can boost efficiency without compromising performance.

Biodegradable Properties

This product meets leading environmental certifications, including ASTM D6400, EN13432, ASTM D6954, and ASTM D6866 standards, ensuring compliance with industrial composting and biodegradability standards. This biodegradable adhesive naturally breaks down under oxygen, UV light, and heat. Once the polymer base is broken down, microorganisms will consume the remaining material without leaving behind harmful byproducts like microplastics.

Contact us if you have more questions about this product's biodegradability.

Other Key Properties of the Tecbond 110B Hot Melt Adhesive

• Energy Efficient: This biodegradable case sealing adhesive can be applied at 130°C, reducing energy consumption and protecting heat-sensitive materials.
• Fast Application & Setting: Optimized for high-speed packaging lines, increasing production efficiency.
• Strong Bonding Performance: Designed for uncoated cardboard and paper, ideal for carton sealing and display packaging.
• Solvent-Free Formula: Safe to handle, with no toxic chemicals or harmful emissions at every stage of its lifecycle.
• FDA Approval: Complying with FDA 175.105 standards, this product can be used in the food and beverage industry.
• Eco-Conscious Degradation: Certified to EN13432, ASTM D6954, and ASTM D6400, the Tecbond 110B-PR biodegradable glue naturally degrades after use without producing microplastics.
• Environmentally Initiated Breakdown: The biodegradable automated packaging adhesive degrades upon exposure to oxygen, UV light, and heat, reducing environmental impact. Consequently, proper storage that limits exposure to these elements is required.

Other Biodegradable Bulk Hot Melt Options

• Tecbond 214B Hot Melt Pellets

Tecbond 110B Product Specifications

• Series: Tecbond 110B
• Product Type: Bulk Biodegradable Hot Melt Pellets
• End Use Applications: High-Speed Packaging
• Chemistry: Synthetic Polymer Based Hotmelt
• Substrates: Paper, Cardboard
• Appearance: Light Brown
• Physical Shape: Pellets
• Package Size: 44 lb Carton
• Recommended Application Temperature: 320°F to 356°F (160°C to 180°C) - Can run at lower temperatures
• Ring and Ball Softening Point (ASTM E28): 239°F (115°C)
• Brookfield Viscosity: 850 cps @ 356°F (180°C)
• Heat Resistance (BS5350 Part H3): 176°F (80°C)
• Molten Tack: High
• Open Time: 10 Seconds
• Brittle Point: 68°F (20°C)
• Certifications:
  • EN13432 Certified
  • Tested to ASTM D6400, D6866, and D6954 Standards
  • FDA 175.105 for Indirect Food Contact
• Shelf Life & Storage: 2 Years from Manufacture Date **This adhesive will begin to degrade as soon as it is exposed to oxygen, UV light, and heat. Store the Tecbond 110B hot glue in its original packaging, away from sunlight, and in temperatures below 86°F (30°C) to limit exposure to these elements.